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Pulsed Laser Deposition System—PLD-400
The pulse laser deposition series equipment is a commonly used oxide and multi-component thin film deposition equipment in universities and research institutes, which has the characteristics of simplicity, reliability, and stable operation. The PLD-400 pulse laser deposition equipment is equipped with 6 1-inch target materials as standard, which can be replaced in situ. Combined with RHEED and excimer lasers, high-quality thin film deposition can be achieved.
Key word:
High-accuracy Magnetron Sputtering System, Film Deposition, Process Debugging, Software Development
Category:
R&D Film Deposition Equipment
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Pulsed Laser Deposition System—PLD-400
Details
The pulse laser deposition series equipment is a commonly used oxide and multi-component thin film deposition equipment in universities and research institutes, which has the characteristics of simplicity, reliability, and stable operation. The PLD-400 pulse laser deposition equipment is equipped with 6 1-inch target materials as standard, which can be replaced in situ. Combined with RHEED and excimer lasers, high-quality thin film deposition can be achieved.
Performance Parameters
| Wafer size | 2inch |
| Extreme vacuum |
5×10-9mbar |
| Heating Temperature | RT-1200℃ |
| Number of Manipulators | Six 1-inch target materials or three 2-inch target materials Revolution and rotation (can rotate independently) |
| Manipulator replace | Replace the target material in situ |
| Laser source | Excimer laser |
| Materials | BFO、SRO、VO2 |
| Space | 3m L*2m W*2m H |
| Options | Automatic transfer, reactive deposition, QCM, process menu, high-pressure RHEED, etc. |
Customer Cases
Vanadium oxide plume (upper) and metal Co plume (lower).
XRD results of vanadium oxide thin films with different thicknesses prepared on Al2O3 (0001) substrate.
XRD results of [(LSMO) m/(BTO) n] N/STO superlattice prepared on STO (002) substrate.
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R&D Magnetron Sputtering System—MS-700
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R&D Magnetron Sputtering System—MS-400
This type of magnetron sputtering system is a multi-function and multi-target magnetron sputtering system, which has the characteristics of ultra-high vacuum, single atomic layer deposition accuracy and simple equipment maintenance. The MS-400 system is equipped with six 2-inch confocal ultra-high vacuum cathodes to meet the needs of process research in the laboratory or enterprise laboratory, with simple maintenance and stable operation.
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