Products

R&D Magnetron Sputtering System—MS-700

The MS-700 magnetron sputtering system is a multifunctional and multi cathode magnetron sputtering system, characterized by ultra-high vacuum and single atomic layer deposition accuracy. Circular cathodes up to 4 inches can be configured according to requirements, with options for vertical sputtering, automatic transmission, reactive sputtering, and film thickness measurement. Suitable for medium to high precision process requirements that require multi target sputtering in research and production.

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R&D Magnetron Sputtering System—MS-400

This type of magnetron sputtering system is a multi-function and multi-target magnetron sputtering system, which has the characteristics of ultra-high vacuum, single atomic layer deposition accuracy and simple equipment maintenance. The MS-400 system is equipped with six 2-inch confocal ultra-high vacuum cathodes to meet the needs of process research in the laboratory or enterprise laboratory, with simple maintenance and stable operation.

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R&D Magnetron Sputtering System - MS-300

The MS-300 magnetron sputtering system has the characteristics of ultra-high vacuum, single atomic layer deposition accuracy, flexible selection of cathode up or down sputtering. The equipment is equipped with three 2-inch ultra-high vacuum cathodes as standard. Meet the needs of laboratory scientific research, with simple maintenance and stable operation.

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Desktop Magnetron Sputtering System —MS-200

The MS-200 magnetron sputtering system is a small desktop sputtering system with high vacuum and single atomic layer deposition accuracy. Flexible selection of cathode up or down sputtering. The equipment is equipped with three 2-inch cathode targets. Meet simple material research needs.

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Vacuum Annealing Furnace-VF-200

Vacuum annealing furnace is an effective way to improve the quality of the film, and heating in a special gas atmosphere can also improve the composition of the film. The VF-200 is a standard annealing furnace from Truth Equipment Corporation, which can be interconnected with other process chambers to achieve in situ annealing, or can be used alone. Alternatively, a magnet module can be selected to induce the direction of magnetic thin films. The system is equipped with control software, ensuring stable and reliable operation!

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Pulsed Laser Deposition System—PLD-400

The pulse laser deposition series equipment is a commonly used oxide and multi-component thin film deposition equipment in universities and research institutes, which has the characteristics of simplicity, reliability, and stable operation. The PLD-400 pulse laser deposition equipment is equipped with 6 1-inch target materials as standard, which can be replaced in situ. Combined with RHEED and excimer lasers, high-quality thin film deposition can be achieved.

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Electron Beam Evaporation System —E-Beam-UHV

The electron beam evaporation system can achieve precise multi-layer thin film preparation in high vacuum and ultra-high vacuum environments. Linear electron beam guns can achieve evaporation of various materials. The equipment can be equipped with a Kaufman ion source to achieve pre cleaning of wafers, which can be used in fields such as superconducting quantum, and is suitable for research and small-scale production in universities and enterprises.

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Electron Beam Evaporation System —E-Beam-HV

The electron beam evaporation system can achieve precise multi-layer thin film preparation in high vacuum and ultra-high vacuum environments. Linear electron beam guns can achieve evaporation of various materials. The equipment can be equipped with a Kaufman ion source to achieve pre cleaning of wafers, which can be used in fields such as superconducting quantum, and is suitable for research and small-scale production in universities and enterprises.

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