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R&D Film Deposition Equipment

Production Film Deposition Equipment

Vacuum Transfer Module

Ultra-high Vacuum Components

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Wafer Vacuum Transfer Module-VTM

Wafer vacuum transfer module adopts quadrilateral, hexagonal or octagonal design, which can realize the interconnection of multiple process chambers. The wafer vacuum transfer module adopts a quadrilateral, hexagonal or octagonal design, which can achieve interconnection of multiple process rooms. The system can be equipped with robotic arms and calibration devices, which can achieve automatic transfer of 8 or 12 inch wafers. The system can be combined with control software to achieve safe and reliable control.

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Wafer Vacuum Transfer Module-VTM

Ultra-high Vacuum Pipe Transfer System

Production magnetron sputtering system is a high performance and high efficiency magnetron sputtering equipment developed for production enterprise laboratories and production line. The MSI-200 magnetron sputtering equipment adopts a design of interconnecting multiple vacuum chambers, and achieves wafer transfer through internal robotic arm of the Cluster. It can be paired with multiple sputtering chambers or processing chambers, suitable for production or experimental lines.

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Ultra-high Vacuum Pipe Transfer System

Two coating systems are directly interconnected

Truth Equipment has also introduced multiple interconnected devices to achieve the interconnection of multiple systems, suitable for 2-8 inch wafers. Ultra-high vacuum transfer of wafers can be achieved through the combination of vacuum pump groups. According to the requirements, two sets of systems can be directly connected, with lower costs and reliable operation. Multiple systems can also be connected through a circular interconnected system. By selecting load lock chambers, ultra-high vacuum transition can be achieved, reducing pollution to the coating system.

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Two coating systems are directly interconnected

Circular interconnected system (external robotic arm, internal robotic arm)

Truth Equipment has also developed multiple interconnected devices to achieve the interconnection of multiple systems, suitable for 2-8 inch wafers. Ultra-high vacuum transfer of wafers can be achieved through the combination of vacuum pump groups. According to the requirements, two sets of systems can be directly connected, with lower costs and reliable operation. Multiple systems can also be connected through a circular interconnected system. By selecting load lock chambers, ultra-high vacuum transition can be achieved, reducing pollution to the coating system.

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Circular interconnected system (external robotic arm, internal robotic arm)
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