Current language:
Wafer Vacuum Transfer Module-VTM
Wafer vacuum transfer module adopts quadrilateral, hexagonal or octagonal design, which can realize the interconnection of multiple process chambers. The wafer vacuum transfer module adopts a quadrilateral, hexagonal or octagonal design, which can achieve interconnection of multiple process rooms. The system can be equipped with robotic arms and calibration devices, which can achieve automatic transfer of 8 or 12 inch wafers. The system can be combined with control software to achieve safe and reliable control.
Key word:
High-accuracy Magnetron Sputtering System, Film Deposition, Process Debugging, Software Development
Category:
Vacuum Transfer Module
产品附件：
TEL
Wafer Vacuum Transfer Module-VTM
Details
The wafer vacuum transfer module adopts quadrilateral, hexagonal or octagonal design, which can achieve the interconnection of multiple process chambers. The system can be equipped with robotic arms and calibration devices, which can achieve automatic transfer of 8-inch or 12-inch wafers. The system can be combined with control software to achieve safe and reliable control.
Performance Parameters
| Wafer size | 8 or 12 inch |
| Extreme vacuum | Better than 5×10-7mbar |
| Front-end Module | Optional EFEM, etc. |
| Port | Four, six, eight (can achieve multiple sets of interconnection) |
| Robotic arm | Optional single arm and double arm, positioning accuracy ± 0.1mm |
| Calibration device | Aligner, calibrate sensor |
| Vacuum system | Mechanical pump and turbo pump, optional ion pump, etc. |
| Control system | PC+PLC Safety interlock, collision protection, vacuum interlock, etc. |
| Standard | SEMI |
Previous
Related products
Production Grade Multifunctional Thin Film Deposition Equipment
This equipment is based on the wafer vacuum transfer platform VTM and can be flexibly equipped with transfer chambers and process chambers. The process chambers can be optionally equipped with electron beam evaporation chambers, molecular beam epitaxy chambers, sputtering chambers, thermal evaporation chambers, and pre cleaning chambers. It can achieve precise deposition of various materials.
R&D Magnetron Sputtering System—MS-700
The MS-700 magnetron sputtering system is a multifunctional and multi cathode magnetron sputtering system, characterized by ultra-high vacuum and single atomic layer deposition accuracy. Circular cathodes up to 4 inches can be configured according to requirements, with options for vertical sputtering, automatic transmission, reactive sputtering, and film thickness measurement. Suitable for medium to high precision process requirements that require multi target sputtering in research and production.
R&D Magnetron Sputtering System—MS-400
This type of magnetron sputtering system is a multi-function and multi-target magnetron sputtering system, which has the characteristics of ultra-high vacuum, single atomic layer deposition accuracy and simple equipment maintenance. The MS-400 system is equipped with six 2-inch confocal ultra-high vacuum cathodes to meet the needs of process research in the laboratory or enterprise laboratory, with simple maintenance and stable operation.
R&D Magnetron Sputtering System - MS-300
The MS-300 magnetron sputtering system has the characteristics of ultra-high vacuum, single atomic layer deposition accuracy, flexible selection of cathode up or down sputtering. The equipment is equipped with three 2-inch ultra-high vacuum cathodes as standard. Meet the needs of laboratory scientific research, with simple maintenance and stable operation.
Provide solutions for your industry and prepare for your choices
Truth Equipment Co., LTD
E-mail:info@truthhefei.com
GeneralAffairs：0551-66026857
Human Resources：0551-66020613
Procurement Consulting：0551-66020659
Commerce Consulting：0551-66020758
Business Consulting：Mr. Hu 19315277762
info@truthhefei.com
WhatsApp
+86-13013196967 