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Production Magnetron Sputtering System—MSI-100-UHV
Production magnetron sputtering system is a high performance and high efficiency magnetron sputtering equipment developed for enterprises, university laboratories and small test lines. This ultra-high vacuum version provides higher deposition chamber vacuum, meeting the needs of high-performance film preparation and small-scale mass production. The extreme vacuum of MSI-100-UHV magnetron sputtering equipment is better than 1×10-8mbar, including load lock chamber and deposition chamber, which can meet the production and preparation needs of high-accuracy nanoscale materials on 8-inch wafers.
Key word:
High-accuracy Magnetron Sputtering System, Film Deposition, Process Debugging, Software Development
Category:
Production Film Deposition Equipment
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Production Magnetron Sputtering System—MSI-100-UHV
Details
Production magnetron sputtering system is a high performance and high efficiency magnetron sputtering equipment developed for enterprises, university laboratories and small test lines. This ultra-high vacuum version provides higher deposition chamber vacuum, meeting the needs of high-performance film deposition and small-scale mass production. The extreme vacuum of MSI-100-UHV magnetron sputtering equipment is better than 1×10-8mbar, including load lock chamber and deposition chamber, which can meet the production and preparation needs of high-accuracy nanoscale materials on 8-inch wafers.
Performance Parameters
| Wafer size | 8inch down compatible |
| Uniformity |
Better than±3% |
| Extreme vacuum |
Better than 1×10-8mbar |
| Load lock | Automatic transfer, optional loading quantity, optional robotic arm gripper shape, independent vacuum system |
| Manipulator heating temperature | Radiant heating, RT-800℃ Optional RT-1200℃ |
| Number of cathodes | Four 4-inch |
| Power supply | DC、RF、DC Pulse |
| Space | 3m L*2m W*2m H |
| Options | Sputtering angle, sputtering direction, Cryogenic pump, reactive sputtering, QCM, process menu, etc. |
Six features know what you need
Corporate/University performance selection
Test list
With the development of semiconductor industry, university laboratories and enterprises have a huge demand for magnetron sputtering equipment with high performance, low cost and high efficiency. The device needs to meet the uniformity of film preparation on an 8-inch wafer.
The figure shows the uniformity test of titanium coated film on 8-inch wafer.(Deposition conditions: 4-inch target inclined deposition of 8-inch wafers, using direct sputtering or increasing the target magnetic field can be increased to less than 2%)
8 inch wafer
The 750μm single-cast wafer was divided into a 1cm×1cm sample, nine slices were taken, the edge was removed and 1cm was fixed along the 8-inch wafer diameter, and the magnetron sputtering titanium film was performed, as shown in the figure below. The test results show that the uniformity of the wafer is < 3%.
Uniformity test results
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R&D Magnetron Sputtering System - MS-300
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