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Molecular Beam Epitaxy System —MBE-400
Molecular beam epitaxy system is the core equipment for preparing high-performance monocrystal thin films in laboratory, which can be used to prepare high-performance oxide materials, topological insulators and so on. The system adopts a modular design to facilitate subsequent upgrades and maintenance, and can be interconnected with other equipments in our company to achieve the deposition of multiple materials.
Key word:
High-accuracy Magnetron Sputtering System, Film Deposition, Process Debugging, Software Development
Category:
R&D Film Deposition Equipment
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Molecular Beam Epitaxy System —MBE-400
Details
Molecular beam epitaxy system is the core equipment for high-performance monocrystal thin film deposition in laboratory, which can be used to achieve the deposition of high-performance oxide materials, topological insulators and so on. The system adopts a modular design to facilitate subsequent upgrades and maintenance, and can be interconnected with other equipments in our company to achieve the deposition of multiple materials.
Performance Parameters
| Wafer size | 2inch |
| Extreme vacuum |
Better than 1×10-10mbar |
| Vacuum measurement | Ion gauge+cathode gauge+Pirani gauge |
| Vacuum pump unit | Mechanical pump + turbo pump+ adsorption pump + cold trap (optional liquid nitrogen) |
| Heating Temperature | RT-800℃，optional RT-1200℃ |
| Evaporation source | Six to ten, different types of evaporation sources and electron beam sources |
| Film thickness measurement | QCM, retractable |
| In situ monitoring | Optional RHEED |
| Load lock | Can load six 2-inch wafers |
| Control system | PC+PLC，Fully automatic operation and safety interlock |
| Space | 3m L*2m W*2m H |
| Options | Cryogenic pump, automatic transfer, reactive sputtering, QCM, process menu, high-pressure RHEED, etc. |
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Production Grade Multifunctional Thin Film Deposition Equipment
This equipment is based on the wafer vacuum transfer platform VTM and can be flexibly equipped with transfer chambers and process chambers. The process chambers can be optionally equipped with electron beam evaporation chambers, molecular beam epitaxy chambers, sputtering chambers, thermal evaporation chambers, and pre cleaning chambers. It can achieve precise deposition of various materials.
R&D Magnetron Sputtering System—MS-700
The MS-700 magnetron sputtering system is a multifunctional and multi cathode magnetron sputtering system, characterized by ultra-high vacuum and single atomic layer deposition accuracy. Circular cathodes up to 4 inches can be configured according to requirements, with options for vertical sputtering, automatic transmission, reactive sputtering, and film thickness measurement. Suitable for medium to high precision process requirements that require multi target sputtering in research and production.
R&D Magnetron Sputtering System—MS-400
This type of magnetron sputtering system is a multi-function and multi-target magnetron sputtering system, which has the characteristics of ultra-high vacuum, single atomic layer deposition accuracy and simple equipment maintenance. The MS-400 system is equipped with six 2-inch confocal ultra-high vacuum cathodes to meet the needs of process research in the laboratory or enterprise laboratory, with simple maintenance and stable operation.
R&D Magnetron Sputtering System - MS-300
The MS-300 magnetron sputtering system has the characteristics of ultra-high vacuum, single atomic layer deposition accuracy, flexible selection of cathode up or down sputtering. The equipment is equipped with three 2-inch ultra-high vacuum cathodes as standard. Meet the needs of laboratory scientific research, with simple maintenance and stable operation.
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