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Production Magnetron Sputtering System—MSI-100-HV
Production magnetron sputtering system is a high performance, low cost and high efficiency magnetron sputtering equipment developed for enterprises, university laboratories and small test lines. The MSI-100 magnetron sputtering equipment adopts a simple and reliable module design, including the load lock chamber and deposition chamber. It can meet the production requirements of nanoscale materials on 8-inch wafers, and has the characteristics of stability, reliability, and low cost.
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Desktop Magnetron Sputtering System —MS-200
The MS-200 magnetron sputtering system is a small desktop sputtering system with high vacuum and single atomic layer deposition accuracy. Flexible selection of cathode up or down sputtering. The equipment is equipped with three 2-inch cathode targets. Meet simple material research needs.
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Vacuum Annealing Furnace-VF-200
Vacuum annealing furnace is an effective way to improve the quality of the film, and heating in a special gas atmosphere can also improve the composition of the film. The VF-200 is a standard annealing furnace from Truth Equipment Corporation, which can be interconnected with other process chambers to achieve in situ annealing, or can be used alone. Alternatively, a magnet module can be selected to induce the direction of magnetic thin films. The system is equipped with control software, ensuring stable and reliable operation!
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Pulsed Laser Deposition System—PLD-400
The pulse laser deposition series equipment is a commonly used oxide and multi-component thin film deposition equipment in universities and research institutes, which has the characteristics of simplicity, reliability, and stable operation. The PLD-400 pulse laser deposition equipment is equipped with 6 1-inch target materials as standard, which can be replaced in situ. Combined with RHEED and excimer lasers, high-quality thin film deposition can be achieved.
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Wafer Vacuum Transfer Module-VTM
Wafer vacuum transfer module adopts quadrilateral, hexagonal or octagonal design, which can realize the interconnection of multiple process chambers. The wafer vacuum transfer module adopts a quadrilateral, hexagonal or octagonal design, which can achieve interconnection of multiple process rooms. The system can be equipped with robotic arms and calibration devices, which can achieve automatic transfer of 8 or 12 inch wafers. The system can be combined with control software to achieve safe and reliable control.
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